10.5kV/1.5kA高温超导电缆绝缘设计及加工

正在研制的75m长10.5kV 1.5kA三相交流高温超导电缆将于2004年底挂网试运行。本文分析75m高温超导电缆的电场分布特点,介绍了该电缆的总体绝缘设计与加工及试验情况。在由超导电缆本体、中间连接及终端模型组成的同实际电缆外体结构一致的电缆集成体模型上,完成了终端及电缆中间连接的绝缘预加工并进行了耐压试验;15kV工频电压下电缆本体绝缘局部放电试验;以及电缆本体及模型电缆集成体绝缘通过了35kV工频耐压试验。     

改善存储备份系统功能的新途径

数据备份是信息系统中保护数据的必要手段，然而，由于备份过程对服务器CPU、服务器I／O及网络资源的占用非常严重，势必影响应用系统的性能。因此，如何规划备份系统也成为IT经理们必然要面临的一个问题。虚拟带库的产品和解决方案就是着眼于这个问题而推出的。本文主要介绍虚拟带库解决方案的工作原理、适用环境以及几个主流厂商的产品，以便更多的读者了解这种新技术。     

各向异性衬底上的高温超导(HTS)微带天线

分析了各向异性衬底上的高温超导微带天线特性.选取两种典型的高温超导各向异性介质--GaNdAlO3和SrLaAlO4作为高温超导微带天线的衬底,采用各向异性媒质中的谱域矩量法,对微带天线的输入阻抗和辐射效率进行了计算.计算和分析结果表明,高温超导衬底的各向异性特性会影响高温超导微带天线的性能,而且这种影响因衬底而异,同时,衬底特性随温度的变化也将影响天线的性能.     

High density packaging technology ultra thin package & new tab package

As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP) which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure, especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1) The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability of the new thin packages is similar to that of the standard thicker plastic packages.     

热敏型压敏胶带的研制

本热敏型压敏胶带的压敏胶以天然橡胶为主体，加入合成橡胶、增粘剂及其他助剂制成。胶带的基材是含有热敏剂的美纹纸。选用了一种比有机硅增粘剂交联温度低而且可以书写的高分子共聚物(100℃以下交联)作为防粘剂。确定了压敏胶的配方和胶带的生产工艺，并检测了各项性能。试验证明，该胶带在常温下无色，在高温时则会显示出标识、字迹或图案。在医学、科研等领域有广泛的用途。     

单面聚酯薄膜补强少胶粉云母带在高压电机主绝缘中的应用研究

将单面聚酯薄膜补强少胶粉云母带与单面玻璃布补强少胶粉云母带交替绕包的绝缘结构用于6kV高压电机主绝缘中，并通过模型线圈的常温介质损耗、介质损耗增量、155℃介质损耗、击穿电压等常规性能测试，样机的测试，研究分析了不同的绕包工艺对绝缘性能的影响。结果表明：采用合理的结构和绕包工艺，绝缘的电气强度有明显提高，综合电气性能获得改善。     

Prediction of friction factors and heat transfer coefficients for turbulent flow in corrugated tubes combined with twisted tape inserts. Part 1: friction factors

A simple mathematical model following the suggestion of Smithberg and Landis has been created to predict the friction factors for the case of a fully developed turbulent flow in a spirally corrugated tube combined with a twisted tape insert. The flow field is divided into two principal regions--a helicoidal core flow modified by secondary circulation effects and a twisting boundary layer flow. The “wall roughness” has an effect simultaneously on the axial velocity, secondary fluid motion and the resulting swirl mixing. The model reflects the influence of the “wall roughness” on the axial and tangential velocity components. The calculated friction factors have been compared with 570 experimental points obtained from 57 tubes tested. Five hundred points (87.7%) have a relative difference of less than ±15%; fifty one points (8.9%) have a difference of within ±(15-20)% and only nineteen points (3.4%) have a relative difference greater than ±20%.     

金属/BAS微晶玻璃复合基板的制备与性能研究

制备了与0Cr18Ni9不锈钢热膨胀相匹配的Ba-Al-Si系微晶玻璃,利用流延法将玻璃制成生瓷带。在不锈钢板表面生瓷带经温压烧结后形成金属/微晶玻璃复合基板。电气性能测试结果,介质层厚度>73.5μm时,击穿电压>1.28kV,泄漏电流<0.05mA;微晶玻璃膨胀系数为10×10–6/℃。     

Solution of transport equations on unstructured meshes with cell-centered colocated variables. Part II: Applications

This paper describes applications of the discretization procedure presented in the companion paper [A.W. Date, Solution of transport equations on unstructured meshes with cell-centered colocated variables. Part I. Discretization, Companion Paper, this volume]. Six problems having different domain complexities, presence of body and surface forces and, boundary conditions are solved. Where possible, the solutions are compared with published experimental or numerical data.     

无溶剂型胶粘带的设计与应用

介绍了无溶剂型胶粘带的研制思路、性能指标和施工技术要点。无溶剂型胶粘带解决了溶剂型胶粘剂污染环境的问题，并可对多种难以粘接的异性材料实现良好的粘结。